Hi, I'm Zhiping Yang - Chief Executive Officer at PCB Automation Inc.
I'm passionate about architecting the future of high-speed electronics, pushing the envelope in Signal and Power Integrity. I thrive on solving complex engineering puzzles and leading teams to innovate within the semiconductor and hardware design space.
At a glance
Curated signals on strengths, focus areas, and how they can help.
Recognized as an IEEE Fellow for pioneering contributions to Signal and Power Integrity.
Leading PCB Automation Inc. as CEO, driving innovation in automated PCB design methodologies.
Can help others by providing expert consultation on complex high-speed circuit and electromagnetic design.
🚀 Career trajectory
Foundational Engineering Roles
Began career with core Signal Integrity engineering roles at Nuova Systems and Apple, building a strong technical foundation.
✦ Signal Integrity
✦ Circuit Design
Senior Technical Leadership
Advanced to Sr. Principal and Principal Engineer roles at Apple, focusing on Power Integrity and complex system design.
✦ Power Integrity
✦ Hardware Architecture
✦ ASIC
Entrepreneurial Vision
Currently leading PCB Automation Inc. as CEO, focusing on innovation and automation in the PCB industry.
✦ CEO
✦ Innovation
✦ Automation
💪🏻 Superpowers
Pioneering High-Speed Design
Expertise in signal, power, and electromagnetic integrity for advanced circuits.
✦ Spearheaded SI/PI analysis for complex high-speed designs.
✦ Mastered IBIS modeling for accurate simulation of semiconductors.
✦ Led EMC and RF desense mitigation strategies.
Strategic Leadership in Electronics
Guiding companies through technological evolution and market challenges.
✦ Serving as CEO at PCB Automation Inc., driving strategic growth.
✦ Managed teams in high-stakes engineering environments at Apple.
✦ Championed advancements in hardware architecture and design.
Deep Technical Acumen
Unparalleled depth in specialized areas of circuit and semiconductor design.
✦ Extensive experience with SERDES, PCIe, and Ethernet technologies.
✦ Proficient in EDA tools for ASIC, SoC, and mixed-signal design.
✦ Proven track record in debugging complex hardware issues.
I'm excited about
✦ Exploring strategic partnerships to drive innovation in PCB/Package design and simulations..
✦ Connecting with leaders in semiconductor technology for future collaborations.
✦ Seeking opportunities to contribute to industry standards and best practices.
I can help with
✦ Provide expert guidance on complex Signal and Power Integrity challenges.
✦ Offer strategic insights for scaling hardware design, simulation, measurement, and manufacturing.
✦ Share deep knowledge on high-speed and high-current design methodologies.
I would love your help on
✦ Identifying emerging technologies that can enhance hardware design automation.
✦ Connecting with potential strategic investors and emploees for PCB Automation Inc.
✦ Finding collaborators with PCB/PCBA fab partners in northern America